The trifold comes with a double inward folding mechanism; pre-orders to open for 50,000 units

Just this week, Huawei brought its second tri-fold, Mate XTs, to Chinese markets. The original Mate XT received more than a million pre-orders, though Samsung’s TriFold will only open orders for 50,000 units. ETNews has reported that the phone will supposedly come later this month and hit shelves in November.

Samsung will also keep from the G-Fold moniker, since the TriFold will come with a double inward fold mechanism. Newsworks has also reported that the phone will have a dedicated Unpacked event on 29th September, where the South Korean tech giant will also be unveiling its XR headset, Project Moohan.

Since the trifold will be a first for the foldable giant, it will be testing its waters with low intake. Part of the reason why Samsung’s only sticking to a relatively shorter production numbers is that it doesn’t want the trifold to overlap with an established Z Fold7, which came out earlier this year.

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Huawei is adding a micro-pump chip to keep the Mate 80 cooler under load

Staying on the 7nm process node, Huawei will upgrade the top-end phones in the Mate 80 lineup, presumably the Mate 80 Pro and Mate 80 Pro+, to the new chipset. The vanilla variant will most likely stick to the Kirin 9020.

This new chip is said to bring decent performance gains, with over 20% gain over last year’s Kirin 9020. Also, Huawei will be putting a new “micro-pump driver chip” to push better power numbers and to keep thermals in check, especially during intensive tasks like gaming or high-res recording.

The Kirin 9030, when compared to a bit older SoCs, like the Kirin 9000s in the Mate 60 Pro from 2023, shows a whopping 40% increase in performance figures alone. The GPU on the Kirin 9030 will also be upgraded, though the exact details of the Maleoon die aren’t known at this point.

Just like every year, Huawei is also rolling out a limited-edition RS model for the Mate 80 series. This will top the lineup this year, and will come with a ceramic back, a titanium alloy frame, and the dual-OLED display from last year’s Mate 70 RS Ultimate.

There hasn’t been a lot of word on pricing for the Mate 80 series just yet, but rest assured that we will keep you updated as new information becomes available.

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Project BreadWinner started as a joke back in 2013 when a page called ‘Give us the Razer Toaster‘ called out Razer to make an actual toaster that gamers could use. The idea gained traction in 2016 when Razer publicly announced the project, albeit as an April Fool’s joke. Of course, Razer’s CEO, Min-Liang Tan, who is known for his outspoken public engagement, took advantage of the opportunity.

In 2019, he promised fans an actual device if the Facebook page got 1 million likes. He even threw in a deal where if someone got a tattoo of the toaster, it’d count as 100,000 likes. Twelve people inked the toaster on themselves, which, to be fair, blew well past the set goal. But, it’s been six years since, and there’s been nothing from Razer’s side, though it does mention “Project BreadWinner” on its website.

SignalRGB’s toaster PC comes with four bread slots and an RTX 5060, too

Now, the RGB control app, SignalRGB, has brought that very idea to light. They’ve built a working toaster, at least one that plays games. It’s a real desktop computer crammed into a toaster-like chassis, with all the bells and whistles that you get with a conventional system.

The chassis houses four breadslots, albeit two of them covered by a 140mm RGB fan underneath. The sides have “artisan handcrafted” ventilation holes for the CPU and GPU, and the ejection levers are repurposed to work as power and restart handles.

On the front, it has two rotatable knobs, and below that, there are two LCD screens, one on each side. The front and center of the PC features an actual Stream Deck, too.

Under the hood, it runs an i5-14600K paired with a Strix Z790-I, with 32 gigs of 6000MT/s RAM. It houses a modest RTX-5060 that is powered by an 850W PSU. There’s no direct I/O available on the system, but it does have a USB-A extension cable that you can connect to an external USB hub. SignalRGB is giving away this “toaster” with a 10-port Thunderbolt 4 dock, in what can be a slight jab at Razer.

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It is important to note that for this feature to work, the entire chain of devices must support the latest Bluetooth 6.0 standard. The Pixel Watch 3 is currently one of the few devices to support this feature, which is why it is inactive for now. You may not be able to use it since the number of devices in the ecosystem is simply too low at this point.

Bluetooth precision tracking isn’t as accurate as Apple’s “Find My,” which has directional arrows to guide you to the exact location. It requires both devices to have Ultra-Wideband (UWB) radio and antenna, which puts the cost too high. In contrast, Bluetooth is supported on nearly every smartphone, headphone, or smartwatch, and may lead to a better overall tracking network.

The Bluetooth Special Interest Group (SIG) introduced “Channel Sounding” in Bluetooth 6.0 late last year, which, instead of the traditional method of measuring signal strength between devices, relies on the time it takes for the signal to travel between two devices. This makes it much more precise in terms of spatial awareness between any two devices.

This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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Samsung to announce the XR headset’s release date at a late September launch event

A report from NewsPim has stated that Samsung will hold a launch event for the headset on September 29, presumably opening pre-orders as well. Nearly two weeks later, on October 13, it is expected to hit shelves in Korea, followed by a global launch.

The device, dubbed “Project Moohan,” will be shown to global audiences at July’s Galaxy Unpacked event. This reveal will then gauge the market reaction before the official launch.

With this, Samsung will be looking to break into a segment dominated by Meta, which has an astounding 84% market share. Much of Project Moohan’s appeal will likely come from its easy integration with existing Android devices since it runs on Google’s “Android XR OS.” Also, the integration of AI features, especially Gemini, across the board will likely stir things up.

There has been no word on the pricing as of this writing, but here’s what we know on the hardware side of things. The Google-powered headset will be the first to sport Qualcomm’s “Snapdragon XR2 Plus Gen2” SoC. This chip is a step-up from the non-Plus version seen on the Meta Quest 3.

Not only this, but it’ll also match the competition on the display side, too. Samsung’s XR headset will come with the same micro-OLED displays that Apple’s Vision Pro uses.

Samsung has already showcased its XR headset several times, the most recent being MWC 2025 in Barcelona earlier this year. But, with new teasers coming out next month, it’ll be interesting to see how the headset fares against the competition.

This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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The name comes from the monitor being clocked in at 540Hz, out of the box. It has a built-in “special mode” that allows it to tone down the resolution in favour of an additional 180Hz, putting it at 720Hz as mentioned earlier.

Unlike ASUS’s “world’s fastest” SWIFT PRO PG248QP, which uses a TN panel, the Flash 540-Meta comes with LG’s 4th Gen OLED display. The 26.5-inch panel peaks at 2560×1440, with a 0.03ms response time at 540Hz.

The downside of SDC’s 720Hz offering is that it doesn’t use the latest display connector spec, and will likely have to rely on DSC. It uses DisplayPort 1.4 and HDMI 2.1 instead of DisplayPort 2.1 and HDMI 2.2, respectively.

Currently, the price is somewhat of a point of speculation. But, sources have mentioned that it is expected to cost roughly 150,000 yen or $1,000 and will be available exclusively in Japan and China.

SDC “Flash 540-Meta” OLED

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Xiaomi’s In-House XRing O1 Puts Respectable Geekbench Numbers on the Board, May Emerge as a Strong Competitor to MediaTek and Qualcomm’s High-End SoCs

After Huawei’s sanction-driven push to in-house SoC development, Xiaomi is now taking a similar pathway. After a decade of research and development, the company is set to push its first in-house chip, the XRing O1, which will “allegedly” debut in the upcoming Xiaomi 15S Pro, expected by the end of May. However, ahead of its release, leaked Geekbench results have already given us an early glimpse into what the performance will look like on this new chip.

The XRing O1 sports an unusual deca-core ‘2 + 4 + 2 + 2′ design, with the high-performing cores alleged to be ARM’s Cortex-X925, two clocked in at 3.90GHz, and four at 3.40GHz. These numbers do hint at a 3nm design, presumably TSMC’s N3P process node, due to such high clock speeds on the X925. It is also claimed that the cluster will be rounded off by two A720 and two A520 cores.

In the Geekbench listings, Xiaomi’s XRing O1 managed to snag a respectable 2723 in single-core and 8665 in multi-core numbers. These figures put it ahead of MediaTek’s Dimensity 9400 and Qualcomm’s Snapdragon 8 Gen 3, in direct comparison. While it still falls short of Qualcomm’s top-tier Snapdragon 8 Elite, the XRing O1 is expected to power Xiaomi’s upper mid-range devices.

At the moment, information is scarce on official metrics. As the release comes close, we can hope to expect more details to pour in for the XRing O1. This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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Microsoft’s Project Kennan Surfaces in Leaked Images as ASUS Handhelds Pass Through FCC Listings

VideoCardz reports that ASUS is eyeing a release date for its next generation of handhelds. This not only includes the expected ROG Ally 2, but also a different “black” model, which surprisingly features a dedicated Xbox button. It is being said that this is on par with rumors of Project Kennan, and that the handheld is expected to run Xbox OS.

The initial series of listings were discovered by 91mobiles, who posted entries for the devices from the Indonesian certification office, which were then later linked to ASUS handheld’s FCC certification listings.

The Black model, which is expected to be from the Xbox collaboration, comes with a higher 36W TDP, thanks to a more powerful SoC in the Ryzen Z2 Extreme. The ROG Ally 2, on the other hand, keeps the power consumption to a modest 20W, and the AMD Aeirth Plus, the successor to the chip from the Steam Deck.

This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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ASUS Is Expected to Stick to the 8-Pin PCI-E Connector, TUF and PRIME to Come in Triple-Fan Models

In a report citing its own sources, VideoCardz has leaked the entire ASUS lineup for the upcoming RTX 5060 Ti. These include the TUF, PRIME, and DUAL series cards, with a China-exclusive Hatsune Miku Edition rounding off the four models.

The report mentions that there’s no information on the clock speeds, but it’s certain that all four models with come factory-overclocked. It also states that the TUF cards will initially launch in the 16GB config only, housing a traditional triple-fan shroud.

As for the other two variants: TUF and PRIME, they’ll come in both 8GB and 16GB models, with the latter featuring a dual-slot design, which will certainly be the cheapest option in the bunch. The pricing hasn’t been confirmed yet, but it’s expected to be close to MSRP, which is expected to be $399 for the 8GB variant and $499 for the 16GB model.

The renders don’t explicitly show the power options on ASUS’ RTX 5060 Ti cards, but we can expect a single 8-pin connector. This is because the company stuck to the same, safer option with the Hatsune Miku model, and other AIBs, such as ZOTAC, have been spotted sidestepping the 12VHPWR and 12V-2×6 connectors, simply because the 180W TDP on the RTX 5060 Ti doesn’t require high-voltage power.

This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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NVIDIA RTX 5060Ti’s TDP Caps Out at 180W, Making 8-Pin the Safer Choice Over 12VHPWR

ZOTAC will stick to the standard 8-pin connector on the 5060Ti, which for a lot of reasons, seems to be the ideal choice. See, the GPU comes with a maximum TDP of 180W, maybe slightly more when OC’d. This is nowhere near the 600W limit that both 12VHPWR and 12V-2×6 are rated for.

Not only this but with melting connectors on the more power-hungry units, it’s a safer option, too. The 12VHPWR was notorious for carrying excess current through one wire if the connector was improperly seated. The 12V-2×6 was, in some respects, an improvement. But, that too seems to operate at excessively high temperatures, even under normal loads. Thus, the 8-pin was a much safer bet.

The 8-pin connector can supply up to 150W from the cable, with an additional 75W from the PCI-E slot, bringing the total available power to approximately 225W. This is enough even for OC models and can also be expected to be seen on the standard RTX 5060.

ZOTAC’s GPUs are split into AMP and Twin Edge models, both of which come with the same 8-pin power connector. Since the TDP isn’t too high, the cards aren’t bulky, and come with a SFF (Small Form Factor) ready, dual-slot design.

Here’s a list of the boost clocks for all of ZOTAC’s six variants:

This is all we know for now, but rest assured that we will keep you updated as new information becomes available.

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